生益SI10U 材料特点

● 低CTE，高模量，可有效降低封装基板的翘曲
● 优异的耐湿热性
● 良好的PCB加工性
● 无卤材料

●较高的玻璃化转换温度

Items	Condition	Unit	SI10U	SI10U LC
Tg	DMA	℃	270	270
Td	5% wt. loss	℃	＞400	＞400
T300	TMA	min	＞60	＞60
CTE (X/Y-axis)	Before Tg	ppm/℃	10	7
Dissipation Constant (1GHz)	2.5.5.9	-	4.6	4.2
Dissipation Factor (1GHz)	2.5.5.9	-	0.006	0.006
Peel Strength	12 um LP	N/mm	0.8	0.8
Flexural Modulus	A	GPa	30	32
Water Absorption	C-168/85/85	%	0.35	0.35
Flammability	UL-94	Rating	V-0	V-0
Heat Resistance	300℃/solder dip	s	＞300	＞300
Heat Resistance after Moisture absorption	PCT 5h+288℃solder 20s	-	Pass	Pass
Halogen free	-	-	Yes	Yes
Glass	-	-	E glass	Low CTE-glass